JPH0579709B2 - - Google Patents

Info

Publication number
JPH0579709B2
JPH0579709B2 JP22517584A JP22517584A JPH0579709B2 JP H0579709 B2 JPH0579709 B2 JP H0579709B2 JP 22517584 A JP22517584 A JP 22517584A JP 22517584 A JP22517584 A JP 22517584A JP H0579709 B2 JPH0579709 B2 JP H0579709B2
Authority
JP
Japan
Prior art keywords
meth
acrylate
compounds
photopolymerizable
molecular weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP22517584A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61103968A (ja
Inventor
Shigenori Nagahara
Shunzo Abe
Hideo Myake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP59225175A priority Critical patent/JPS61103968A/ja
Publication of JPS61103968A publication Critical patent/JPS61103968A/ja
Publication of JPH0579709B2 publication Critical patent/JPH0579709B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP59225175A 1984-10-25 1984-10-25 光硬化型可撓性ソルダ−・レジスト・インキ Granted JPS61103968A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59225175A JPS61103968A (ja) 1984-10-25 1984-10-25 光硬化型可撓性ソルダ−・レジスト・インキ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59225175A JPS61103968A (ja) 1984-10-25 1984-10-25 光硬化型可撓性ソルダ−・レジスト・インキ

Publications (2)

Publication Number Publication Date
JPS61103968A JPS61103968A (ja) 1986-05-22
JPH0579709B2 true JPH0579709B2 (en]) 1993-11-04

Family

ID=16825126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59225175A Granted JPS61103968A (ja) 1984-10-25 1984-10-25 光硬化型可撓性ソルダ−・レジスト・インキ

Country Status (1)

Country Link
JP (1) JPS61103968A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290998A (ja) * 1985-10-03 1987-04-25 日本曹達株式会社 無電解メツキ用光硬化型レジスト樹脂組成物
JPH01126659U (en]) * 1988-02-10 1989-08-30
JPH01125435U (en]) * 1988-02-16 1989-08-28
JP2002226519A (ja) * 2001-02-02 2002-08-14 Dai Ichi Kogyo Seiyaku Co Ltd エネルギー線硬化型樹脂組成物及びそれを用いた塗料
JP4979318B2 (ja) * 2005-10-07 2012-07-18 三菱レイヨン株式会社 ラジカル重合性樹脂組成物
JP5224640B2 (ja) 2005-10-07 2013-07-03 昭和電工株式会社 カルボキシル基含有ポリウレタンおよび熱硬化性ポリウレタン樹脂組成物

Also Published As

Publication number Publication date
JPS61103968A (ja) 1986-05-22

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